Pni SENtral Manual de usuario descargar pdf (Pagina 38)

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SENtral Technical Data Sheet Page 37

Figure 8-1 provides design parameters for a typical SENtral solder mask and pad pattern.

Figure 8-1: Typical Solder Mask and Land Pad Parameters

A typical recommended solder reflow profile is given in Figure 8-2 and the associated processing

parameters are given in Table 8-1, both on the following page. Oven type and tolerances,

thermocouple tolerance, solder type, and the temperature difference across the board will affect

the actual implemented profile.

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Pni SENtral Manual de usuario Pagina 38